Sliding Table Hot Bar Soldering Machine PCB Heat Bonding Machine
Features:
1. According to different products, optional temperature for your choice.
2. Unique material thermode head, ensure the average pressure
3. Has vacuum function, easier for adjustment and positioning.
4. NC temperature, clear and high precision
5. With digital pressure gauge, pressure range can be preset.
6. Microcomputer control, high accuracy and stable.
7. Programmable curve Including pre-heating and reflow soldering temperature.
8. Suitable for all kinds of high density TAB, TCP and pressure to FPC, FFC and PCB soldering pressure welding.
9. Precise PID control, phase angle replace pulse drive.
10. Less Libration, less noise, avoiding voltage fluctuate
11. Real-time display temperature curve and temperature data.
12. Touch screen input data, simplify the operation.
Specification:
| Machine size | 660×660×700mm |
| Working area | Max 200*170mm |
| Machine weight | 92Kg |
| Working air pressure | 0.6-0.8Mpa |
| Fixture quantity | 1 |
| Thermode head size | Max 80*5mm |
| Welding precision | pitch 0.2mm |
| Pressing time | 1~99.9s |
| Temperature settings | RT~500℃ tolerance ±5℃ |
| Welding pressure | 1~20Kg |
| Temperature settings | Two |
| Working environment | 10-60℃,40%-95% |
| Power supply | AC220V±10% 50HZ,2200W |
| Alignment mode | CCD + LCD Monitor |
| Feeding mode | Manual |
| Starting mode | Press start button |
| Rotation Platform | Cylinder control,tolerance<0.02mm |
Applications:
1. FFC to PCB
2. FPC to PCB
3. Wires to PCB
4. HSC to PCB
5. HSC to LCD
Heat Sealing Paratmeter:
1. Temperature range: 50℃ to 400℃
2. Temperature accuracy: ±1°C
3. Bond timer: 0-12 seconds
4. Bond air pressure: 0.4-0.6MPa
5. Pressure accuracy: ±0.05MPa
6. Max bond force: 1100N
Thermode Specification:
1. Max thermode area: 340mm2
2. Max thermode length: 80mm
3. Thermode stroke:50mm
4. Actual type: pneumatic
Product Tags:
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Sliding Table Hot Bar Soldering Machine 92Kg PCB Heat Bonding Machine Images
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